Competency Profile Chart (CPC)
Memaparkan 861-880 daripada 12,554 items.
| Bil | Competency | Tajuk Competency Unit (CU) | Lihat Terperinci |
|---|---|---|---|
| 861 | Core | SEMICONDUCTOR PACKAGE MOLDING | Job Description (JD) |
| 862 | Core | SEMICONDUCTOR LEAD PLATING | Job Description (JD) |
| 863 | Core | SEMICONDUCTOR PACKAGE TRIM & FORM | Job Description (JD) |
| 864 | Core | SEMICONDUCTOR PRODUCT MARKING | Job Description (JD) |
| 865 | Core | SEMICONDUCTOR FINISH PRODUCT TESTING | Job Description (JD) |
| 866 | Core | SEMICONDUCTOR PRODUCT INSPECTION | Job Description (JD) |
| 867 | Core | SEMICONDUCTOR PRODUCT PACKING | Job Description (JD) |
| 868 | Core | SEMICONDUCTOR PRE-OPERATION MAINTENANCE | Job Description (JD) |
| 869 | Elektif | SEMICONDUCTOR WAFER PROBING | Job Description (JD) |
| 870 | Elektif | SEMICONDUCTOR WAFER BACK GRINDING | Job Description (JD) |
| 871 | Elektif | SEMICONDUCTOR BALL GRID ARRAY (BGA) AND BALL MOUNT | Job Description (JD) |
| 872 | Core | EQUIPMENT SET UP AND START UP COMMISSIONING | Job Description (JD) |
| 873 | Core | MANUFACTURING TOTAL PRODUCTIVE MAINTENANCE ASSURANCE | Job Description (JD) |
| 874 | Core | MANUFACTURING TOOLING MAINTENANCE ASSURANCE | Job Description (JD) |
| 875 | Core | MANUFACTURING QUALITY CONTROL | Job Description (JD) |
| 876 | Core | TOOL AND JIG ENHANCEMENT | Job Description (JD) |
| 877 | Elektif | PERSONNEL CONCERNING ISSUES / NEEDS / WELFARE MANAGEMENT | Job Description (JD) |
| 878 | Core | PERSONNEL, MACHINERY, WORK PLACE SAFETY AND HEALTH COMPLIANCE ASSURANCE | Job Description (JD) |
| 879 | Core | TECHNICAL STANDARD OPERATING PROCEDURES DEVELOPMENT | Job Description (JD) |
| 880 | Core | EQUIPMENT AND PROCESS CHARACTERISATION | Job Description (JD) |