Competency Profile Chart (CPC)
Memaparkan 841-860 daripada 12,607 items.
| Bil | Competency | Tajuk Competency Unit (CU) | Lihat Terperinci |
|---|---|---|---|
| 841 | Core | SHIP ELECTRONIC NAVIGATION MAINTENANCE | Job Description (JD) |
| 842 | Core | SHIP ELECTRONIC CONTROL SYSTEM MAINTENANCE | Job Description (JD) |
| 843 | Core | SHIP ELECTRONIC SPECIAL EQUIPMENT MAINTENANCE | Job Description (JD) |
| 844 | Elektif | SHIP ELECTRICAL WIRING INSTALLATION | Job Description (JD) |
| 845 | Core | AUTOMOTIVE ENGINE CYLINDER HEAD ASSEMBLY | Job Description (JD) |
| 846 | Core | AUTOMOTIVE ENGINE SHORT BLOCK ASSEMBLY | Job Description (JD) |
| 847 | Core | AUTOMOTIVE "ENGINE COMPLETE" ASSEMBLY | Job Description (JD) |
| 848 | Core | AUTOMOTIVE ENGINE AUXILIARY COMPONENT ASSEMBLY | Job Description (JD) |
| 849 | Core | AUTOMOTIVE ENGINE INITIAL FIRING TEST | Job Description (JD) |
| 850 | Core | AUTOMOTIVE ENGINE ASSEMBLY SUPERVISORY FUNCTION | Job Description (JD) |
| 851 | Elektif | AUTOMOTIVE ENGINE PERFORMANCE TEST | Job Description (JD) |
| 852 | Core | SEMICONDUCTOR WAFER MOUNT AND DICING | Job Description (JD) |
| 853 | Core | SEMICONDUCTOR DIE ATTACH | Job Description (JD) |
| 854 | Core | SEMICONDUCTOR WIRE AND CLIP BONDING | Job Description (JD) |
| 855 | Core | SEMICONDUCTOR PACKAGE MOLDING | Job Description (JD) |
| 856 | Core | SEMICONDUCTOR LEAD PLATING | Job Description (JD) |
| 857 | Core | SEMICONDUCTOR PACKAGE TRIM & FORM | Job Description (JD) |
| 858 | Core | SEMICONDUCTOR PRODUCT MARKING | Job Description (JD) |
| 859 | Core | SEMICONDUCTOR FINISH PRODUCT TESTING | Job Description (JD) |
| 860 | Core | SEMICONDUCTOR PRODUCT INSPECTION | Job Description (JD) |