Competency Profile Chart (CPC)
Nama NOSS : Pengeluaran Pemasangan Semikonduktor
Kod NOSS : EE-020-3:2013
Tahap : 3
Memaparkan 1-14 daripada 14 items.
| Bil | Competency | Tajuk Competency Unit (CU) | Lihat Terperinci |
|---|---|---|---|
| 1 | Core | SEMICONDUCTOR WAFER MOUNT AND DICING | Job Description (JD) |
| 2 | Core | SEMICONDUCTOR DIE ATTACH | Job Description (JD) |
| 3 | Core | SEMICONDUCTOR WIRE AND CLIP BONDING | Job Description (JD) |
| 4 | Core | SEMICONDUCTOR PACKAGE MOLDING | Job Description (JD) |
| 5 | Core | SEMICONDUCTOR LEAD PLATING | Job Description (JD) |
| 6 | Core | SEMICONDUCTOR PACKAGE TRIM & FORM | Job Description (JD) |
| 7 | Core | SEMICONDUCTOR PRODUCT MARKING | Job Description (JD) |
| 8 | Core | SEMICONDUCTOR FINISH PRODUCT TESTING | Job Description (JD) |
| 9 | Core | SEMICONDUCTOR PRODUCT INSPECTION | Job Description (JD) |
| 10 | Core | SEMICONDUCTOR PRODUCT PACKING | Job Description (JD) |
| 11 | Core | SEMICONDUCTOR PRE-OPERATION MAINTENANCE | Job Description (JD) |
| 12 | Elektif | SEMICONDUCTOR WAFER PROBING | Job Description (JD) |
| 13 | Elektif | SEMICONDUCTOR WAFER BACK GRINDING | Job Description (JD) |
| 14 | Elektif | SEMICONDUCTOR BALL GRID ARRAY (BGA) AND BALL MOUNT | Job Description (JD) |