Job Description (JD)
| Nama Program | Pengeluaran Pemasangan Semikonduktor [EE-020-3:2013] |
|---|---|
| Kod CU | EE-020-3:2013-E03 |
| Competency | Elektif |
| Tajuk CU | SEMICONDUCTOR BALL GRID ARRAY (BGA) AND BALL MOUNT |
| Penerangan CU | This semiconductor Ball Grid Array BGA and ball mount bonding technique is the competency in performing the BGA and ball semiconductor mounting technique. A semiconductor chip having a plurality of pads along its centre, a substrate having a slot of a predetermined size along its centre, and a signal line plane including a signal line pattern and a plurality of ball mounts on its one side, with the semiconductor chip being mounted on the other side. A bonding material is inserted between the semiconductor chip and the substrate to fix the semiconductor chip to the substrate. A plurality of balls is mounted on the plurality of ball mounts to be connected to an external circuit. The person who is competent in this competency unit shall be able to prepare, set up machine and carry out semiconductor wafer back grinding to work requirements and process procedure. The outcome of this competency is to ensure successful of BGA and ball mount bonding production are free from dented, misfit, accurate to machine recipe information and produce with standard processing time. |
| Tempoh Latihan | 160 |
| Objektif Pembelajaran | The person who is competent in this competency unit shall be able to ensure successful of BGA and ball mount bonding production are free from dented, misfit, accurate to machine recipe information and produce with standard processing time. Upon completion of this competency unit, trainees will be able to:- • Identify die attached product and peripherals for BGA bonding process requirement • Set up machine for BGA bonding process • Carry out BGA bonding process • Inspect BGA bonding product result and quality • Identify product for ball mount process • Set up machine for ball mount process • Carry out ball mount process • Inspect ball mount product result and quality |
| Pra-Syarat | 0 |