Job Description (JD)
| Nama Program | Pengeluaran Pemasangan Semikonduktor [EE-020-3:2013] |
|---|---|
| Kod CU | EE-020-3:2013-C06 |
| Competency | Core |
| Tajuk CU | SEMICONDUCTOR PACKAGE TRIM & FORM |
| Penerangan CU | Semiconductor package trim and form is the competency in performing package trim and form to provide a semiconductor package and a printed circuit board (PCB). The person who is competent in this competency unit shall be able to prepare, set up machine, and carry out and inspect of semiconductor package forming to fulfil work requirements and process procedure. The outcome of this competency is to achieve successful in package trim and forming production process are free from damaged, accurate to lot traveller parameter and produce in standard time. |
| Tempoh Latihan | 160 |
| Objektif Pembelajaran | The person who is competent in this competency unit shall be able to process of product marking production are free from dented, accurate to pattern and devices version and produce within standard time. Upon completion of this competency unit, trainees will be able to:- · Identify product for product marking flow requirement · Set up machine for product marking process · Carry out product marking process · Inspect product marking product result and quality |
| Pra-Syarat | 0 |