Job Description (JD)
| Nama Program | Pengeluaran Pemasangan Semikonduktor [EE-020-3:2013] |
|---|---|
| Kod CU | EE-020-3:2013-C02 |
| Competency | Core |
| Tajuk CU | SEMICONDUCTOR DIE ATTACH |
| Penerangan CU | Semiconductor die attach is the competency in performing die attach which is the processing of attaching the silicon chip to the die pad or die cavity to support the structure of the semiconductor package. There are two common die attach methods, using adhesive or eutectic to perform die attach. The person who is competent in this competency unit shall be able to prepare, set up machine, carry out and inspect semiconductor wafer die attach to check work requirements and process procedure. The outcome of this competency is to achieve successful die attach process are free from damaged or misaligned and produce within standard production time based on lot traveller parameter. |
| Tempoh Latihan | 160 |
| Objektif Pembelajaran | The person who is competent in this competency unit shall be able to achieve successful in die attach process are free from damaged or misaligned and produce within standard production time based on lot traveller parameter. Upon completion of this competency unit, trainees will be able to:- · Identify die attach process · Set up machine for die attach process · Carry out die attach process · Inspect die attach product result and quality |
| Pra-Syarat | 0 |