Job Description (JD)
| Nama Program | Pengeluaran Pemasangan Semikonduktor [EE-020-3:2013] |
|---|---|
| Kod CU | EE-020-3:2013-C01 |
| Competency | Core |
| Tajuk CU | SEMICONDUCTOR WAFER MOUNT AND DICING |
| Penerangan CU | Semiconductor wafer dicing is the competency in performing wafer dicing the process by which dies is separated from a wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a machine called a dicing saw) or by laser cutting. The person who is competent in this competency unit shall be able to prepare, set up machine, carry out and inspect semiconductor wafer dicing process to check work requirements and process procedure. The outcome of this competency is to successful process wafer product dicing for individual silicon chips free from damaged and misaligned when encapsulate into chip carrier which is a suitable building electronic device usage in within standard time given |
| Tempoh Latihan | 200 |
| Objektif Pembelajaran | The person who is competent in this competency unit shall be able in performing wafer dicing process wafer product dicing for individual silicon chips free from damaged and misaligned when encapsulate into chip carrier which is a suitable building electronic device usage in within standard time given. Upon completion of this competency unit, trainees will be able to:- · Identify wafer mounting process · Set up machine for mounting process · Carry out wafer mounting process · Inspect mounting product result and quality · Identify wafer dicing process · Set up machine for dicing process · Carry out wafer dicing process · Inspect dicing product result and quality |
| Pra-Syarat | 0 |